Capillary absorption of liquid along the fibres of the base material.

A needle-shaped metallic growth on a printed circuit board.

The formation of a relatively uniform, smooth, unbroken and adherent film of solder to a base material.

A condition of base material in which a weave pattern of glass cloth is appearing on the surface though the unbroken fibres of the woven cloth are completely covered with resin.

The technique of joining parts to a PCB by passing the assembly over a wave of molten solder so as to coat the pre-fluxed areas to be joined.

A surface condition of base material in which the unbroken fibres of woven glass cloth are not completely covered by resin.