The deformation of a rectangular sheet, panel or printed board, that occurs parallel to a diagonal across its surface in such a way that one of the comers of the sheet is not in the plane formed by the other three corners.
Trim_LinesLines which define the borders of a printed board.
TriazineDielectric material with higher glass transition temperature and better thermal stability than epoxy resin, however, more expensive and not in common use.
Thmsmission_LineA signal-carrying circuit composed of conductors and dielectric materialwith controlled electrical characteristics used for the transmission of high-frequency or narrow-pulse type signals.
Transmission_CableTwo or more transmission lines.
TracesThe metallic conductive strips that provide connections between components, terminals, etc., on printed circuits.
TraceA single conductive path in a conductive pattern.
TombstoningA soldering defect in which a chip component moves into a vertical position during solidification of the solder so that only one terminal is connected. It is caused by defective re-flow processing.
Tolling_HoleAlso called fabrication hole, pilot hole, or manufacturing hole. These are used as PCB reference points upon which other dimensions are based.
TinningThe application of molten solder to a basis metal in order to increase its solderability.
Through_ConnectionAn electrical connection between conductive patterns on opposite sides of an insulating base, e.g. plated through-hole or clinched jumber wire.
ThermosetA plastic cured or hardened by heating into a permanent shape. Thermosets cannot be re-melted.
ThermoplasticA plastic set into final shape by forcing the melted polymer into a cooled mould. The hardened form can be re-melted several times.
ThermocoupleA device made of two dissimilar metals which, when heated, generate a voltage that is used to measure temperatures.
Test_PointSpecial points of access to an electrical circuit, used for testing purposes.
Test_PatternA pattern used for inspection or testing purposes.
Test_FixtureA device that adapts a specific assembly under test system via inter-connection.
Test_CouponA pattern as an integral part of the PCB on which electrical tests may be made to non-destructively evaluate process control. A portion of a circuit used exclusively to functionally test the circuit as a whole.
Test_BoardA printed board suitable for determining acceptability of the board or of a batch of boards produced with the same process so as to be representative of the production board.
Terpenes(Turpentine)A solvent used in cleaning electrical assemblies.
TerminationThe part of component that makes contact with a pad on a substrate.
Terminal_AreaA portion of a conductive pattern usually, but not exclusively, used for the connection and/or attachment of components.
TentingA printed board fabrication method of covering over plated through-holes and the surrounding conductive pattern with a resist, usually dry film.
Tented_ViaA via with solder mask completely covering both its pad and its plated through-hole. This completely insulates the via from foreign objects, thus protecting against accidental shorts, but it also renders the via unusable as a test point.
Temperature_ProfileThe depiction of the temperature that a selected point traverses as it passes through the re-flow process.
TeflonDu Pont trade name as an inventor for PTFE(Polytetrafluoroethylene).
Taped_ComponentsComponents attached to continuous tape for automatic assembly.
Tape_and_reelA packaging method of housing surface-mount parts intheir own tape cavities in a long continuous strip. The cavities are covered so that the tape can be wound around a reel for convenient handling and machine set-up.