Non plated though-hole.
Non_wettingA condition whereby a surface has contacted molten solder, but has had none of the solder adhere to it.
Non_polar_compoundMaterial having electrical charges distributed over the surface of the molecule, thereby showing an electrical effect in solution.
Non_functional_LandA land on internal or external layers, not connected to the conductive pattern on its layer.
Non_conductive_PatternA configuration formed by functional non-conductive material of a printed circuit.
Non_conductive_EpoxyAn epoxy resin with or without a filler, which may be added to improve thermal conductivity.
Non_clean_solderA process using specially formulated low-solid solder pastes whose residues require no cleaning.
NodeA pin, lead or even junction which will have at least one wire connected to it.
NFPNon-functional pad.
NeutralizerAn alkaline chemical added to water to improve its ability to dissolve flux residues.
NetlistA net is a junction of component nodes. A netlist is a collection of nets that define all the connections in a circuit. It is obtained automatically from a schematic capture program.
Negative–acting_ResistA resist which is polymerized (hardened) by light and which, after exposure and development remains on the surface of a laminate in those areas which were under the transparent parts of a production ,master.
Negative_(Noun)An artwork, artwork master, or production master in which the intended conductive pattern is transparent to light, and the areas to be free from conductive material are opaque.
Nail_HeadingThe flared condition of copper on the inner conductor layers of a multi-layer board usually caused by hole drilling.