NPTH

Non plated though-hole.

Non_wetting

A condition whereby a surface has contacted molten solder, but has had none of the solder adhere to it.

Non_polar_compound

Material having electrical charges distributed over the surface of the molecule, thereby showing an electrical effect in solution.

Non_functional_Land

A land on internal or external layers, not connected to the conductive pattern on its layer.

Non_conductive_Pattern

A configuration formed by functional non-conductive material of a printed circuit.

Non_conductive_Epoxy

An epoxy resin with or without a filler, which may be added to improve thermal conductivity.

Non_clean_solder

A process using specially formulated low-solid solder pastes whose residues require no cleaning.

Node

A pin, lead or even junction which will have at least one wire connected to it.

NFP

Non-functional pad.

Neutralizer

An alkaline chemical added to water to improve its ability to dissolve flux residues.

Netlist

A net is a junction of component nodes. A netlist is a collection of nets that define all the connections in a circuit. It is obtained automatically from a schematic capture program.

Negative–acting_Resist

A resist which is polymerized (hardened) by light and which, after exposure and development remains on the surface of a laminate in those areas which were under the transparent parts of a production ,master.

Negative_(Noun)

An artwork, artwork master, or production master in which the intended conductive pattern is transparent to light, and the areas to be free from conductive material are opaque.

Nail_Heading

The flared condition of copper on the inner conductor layers of a multi-layer board usually caused by hole drilling.