A hollow tube inserted in a terminal or printed board to provide mechanical support for component leads or electrical connection.
Extraneous_CopperUnwanted copper remaining on the base material after chemical processing.
ExothermThe characteristic curve of a resin during cure showing reaction of temperature vs. time.
EtchingRemoval of metal from the surface of PCB by chemical dissolution. The process is normally carried out selectively by masking areas of metal which are to be left on the PCB.
Etched_Printed_BoardA board having a conductive pattern formed by the chemical removal of unwanted portions of the conductive foil.
Etch_backThe controlled removal of all resins of base material on the side wall of holes in order to expose internal conductor areas.
EtchantA solution used to remove, by chemical reaction, the unwanted portion of material from a printed board.
ETCH_ResistAn organic ink, lacquer, photo-resist, self-adhesive plastic tape, metal deposit or other material which will prevent specific areas of the metal on a panel from being attacked by an etchant.
Etch_FactorThe ratio of the depth of etch (conductor thickness) to the amount of lateral etch (undercut).
ESDElectro-Static-Discharge, the sudden transfer or discharge of electricity from one object to another.
ESD_Sensitivity(ESD susceptibility) The device’s ability to dissipate the energy of the discharge or withstand the current levels involved.
Escape_RateThe percentage of defects not defected vs. the total inspected.
ERCElectrical Rule Check: checks the integrity of a circuit (SCH) so that problems like open inputs, shorted outputs and much more are recognized.
ERBGFEpoxy Resin Bonded Glass Fibre (See FR4).
Epoxy_SmearEpoxy resins which has been deposited onto the surface or edges of the conductive pattern during drilling. Also called resin smear.
Epoxy_ResinsMaterials that form straight chain thermoplastic and thermosetting resins having good mechanical properties and dimensional stability.
EntrapmentThe damaging admission and trapping of air, flux and fumes; it is caused by contamination and plating.
Emulsion_SideThe side of the film on which the photographic image is defined.
Embedded_ComponentA discrete component that is fabricated as an integral part of a printed board.
Electron_beam_BondingTerminations made by heating with a stream of electrons in a vacuum.
ElectroplatingThe electrodeposition of a metal coating on a conductive object. The object to be plated is placed in an electrolyte and connected to the relative terminal of a dc voltage source. The metal to be deposited is similarly immersed and connected to the positive terminal. Ions of the metal provide transfer to metal as they make up the current flow between the electrodes.
Electroless_DepositionThe deposition of conductive material from an auto-catalytic plating solution without application of electrical current.
Electroless_CopperA layer of copper plated on to an insulating or conductive surface of a PCB by chemical reduction, that is, without the use of applied electrical current.
Edge_board_ContactsA series of contacts printed on or near any edge of a printed board and intended for mating with an edge-board connector.
Edge_SpacingThe distance of a pattern, components, or both, from the edges of the printed board and intended for mating with an edge-board connector.
Edge_ConnectorA connector (can be gold-plated edge contacts or a series of parallel lines of holes).
Edge_ClearanceThe distance of a pattern, components, or both, from the edges of the printed circuit board.