The clearance around a pad, track, zone or via that defines the nearest approach allowed by conductors of another signal set.
IPCThe Institute for Interconnecting and Packaging Electronic Circuits, an American organization.
Interstitial_Via_HoleA plated through-hole connecting two or more conductor layers of a multilayer printed board but not extending fully through all the layers of base material comprising the board.
Internal_LayerA conductive pattern which is contained entirely within a multi-layer printed board.
Inter_layer_ConnectionAn electrical connection between conductive patterns in different layers of a multi-layer printed board. (See also Through Connection.)
Inter_facial_ConnectionSee Through Connection.
Insulation_ResistanceThe electrical resistance of the insulating material (determined under specified conditions) between any pair of contacts, conductors, or grounding device in various combinations.
Inspection_OverlayA positive or negative transparency made from the production master and used as an inspection aid.
Inspection_LotA collection of units of products bearing identification and treated as a unique entity from,which a sample is to be drawn and inspected to determine conformance with the acceptability criteria.
Initiatingsee activating"."
INDEX_EDGEINDEX EDGE MARKER, INDEXING HOLE, INDEXING NOTCH, INDEXING SLOT: See Locating Edge, Location Edge Marker,etc.
InclusionA foreign particle in the conductive layer, plating, or base material.
In_circuit_TestA check of specific components(s) or cuicuits(s) within an assembly without their de-coupling from the primary circuit.
Impedance,_CharacteristicThe resistance of a parallel conductor structure to the flow of alternating current (ac), usually applied to high-speed circuits and normally consisting of a constant value over a wide range of frequencies.
Immersion_PlatingThe chemical deposition of a thin metallic coating over certain basis metals that is achieved by a partial displacement of the basis metal.
IndentationSee “Pit”
ICIntegrated Circuit.