A surface mounted device lead which flares outward from the device body.
Guided_probe_methodA technique for volume production of PCBs based on incoming inspection to catch the majority of device failures and inspection prior to populating, that will eliminate most manufacturing errors.
Ground_Plane_ClearanceRemoved portions of a ground plane that serves to isolate it form a hole in the base material to which the plane is attached
Ground_PlaneA conductor layer, or portion of a conductor layer, used as a common reference point for circuit returns, shielding, or heat sinking. All those areas, not consumed by traces or pads, of the PCB which are left unetched and tied to the ground on the board.
GridAn orthogonal network of two sets of parallel, equidistant lines used for locating points on a printed circuit board.
Go/No_Go_TestProcedure to yield only pass or fail.
Glob_TopA coating process in which a set portion of resin is dispensed on the top of a chip or board. After spreading over the entire surface ,it is cured to form a soild protective coating.
Glass_EpoxyA material used to fabricate printed circuit boards. The base material (fibre-glass) is impregnated with an epoxy filler which then must have copper laminated to its outer surface to form the material required to manufacture printed circuit board.
GILaminate made from woven glass fibre material impregnated with polyimide resin.
GerberVector-based language, developed by Gerber Scientific Instrument Company, for sending commands to photoplotters.
Gas_BlanketA flowing inert gas atmosphere used to keep metal from oxidizing.